<?xml version="1.0" encoding="UTF-8"?>








                        
<?xml-stylesheet type="text/xsl" href="http://www.jobvolume.com/htm/jobvolume-rss20.xsl" version="1.0"?>  

<rss version="2.0">
	<channel>
		<title> Jobs at Intel    </title>
		<link>http://www.jobvolume.com/rss/jobs-q-company%3A%22Intel%22.xml</link>
		<description> Jobs at Intel    </description>
		<language>en-us</language>
		<copyright>Copyright (c) 2006 Jobvolume All rights reserved.</copyright>
		<lastBuildDate>Wed, 3 Dec 2008 06:53:09 GMT</lastBuildDate>

        
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                        <title><![CDATA[Software Engineer at Intel, (USA-CA-Santa Clara)]]></title>
                        <link>http://www.jobvolume.com/jobid.jsp?jkey=1968274333</link>
                        <guid isPermaLink="false">1968274333</guid>
                        <pubDate>Tue, 2 Dec 2008 15:04:19 GMT</pubDate>
                        <description><![CDATA[Job Description: Software Engineers conduct or participate in multidisciplinary research and collaborate with design, layout and/or hardware engineers in the design, development, and utilization of productivity tools to validate silicon health and behavior. Design and develop code to characterize silicon behavior in an operating system environment. Develops utility programs across multiple operating systems. Develops solutions to problems utilizing formal education, judgment and formal software process.
You must possess a Master of Science degree in Computer Science or related field with two years of industry experience(or a Bachelor of Science degree with more than four years of industry experience). Additional qualifications include: 
- Strong programming experience in C, C++, Windows .Net*, Assembly Language 
- Strong porting experience from Windows environment to UNIX* based environment or to Mac* OS X 
- Familiarity with Intelï¿½ microprocessor architecture, chipsets, memory systems 
- Good analytical skills 
- Ability to multitask with excellent experience in cross-team interaction 
- Strong initiatives and a self-starter 
- Understanding of software architecture, software development and integration process, working knowledge of PC operating systems, and strong debug skills 
- GUI development experience 
- Strong communication skills
Intel&apos;s Software and Solutions Group (SSG) works to increase the value of Intel&apos;s products by enhancing all levels of software that executes on Intel based platforms. The group is directly engaged in design, engineering and diffusion of PC software technologies. The Intelï¿½ Software Network (ISN) provides a network of resources for professional developers at independent software vendors as well as corporate Information Technology (IT) shops, including access to technical libraries, support, education, and training. The Intel Software Development Products are a full suite of tools that help software developers create the best software possible on Intelï¿½ architecture. For corporate end users, Intel Solution Services, a professional consulting organization, uses its foremost expertise in Intelï¿½ architecture and next-generation technologies to design cost-effective, cutting-edge solutions to complex business challenges and helps businesses get the most out of their IT investments. Intel Software College provides on-site training on Intel software development tools and the latest Intelï¿½ products and technologies. Software represents a key element in Intel&apos;s drive to advance the entire PC platform.
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                        <title><![CDATA[Eng Undergrad Technical Intern at Intel, (USA-MA)]]></title>
                        <link>http://www.jobvolume.com/jobid.jsp?jkey=624195681</link>
                        <guid isPermaLink="false">624195681</guid>
                        <pubDate>Tue, 2 Dec 2008 15:04:09 GMT</pubDate>
                        <description><![CDATA[In this position, you will be part of the Process Engineering Group. You will be responsible for engineering support activities which may include web page or database management, experimental design, mechanical design and/or troubleshooting, data collection and analysis.
You must currently be a college student in pursuit of a Bachelor of Science degree or a Master of Science degree in Electrical, Chemical, Mechanical Engineering or in related engineering field. Additional qualifications include: 
- Strong engineering troubleshooting and analytical skills 
- Good team participation skills 
- Strong communication and teamwork skills 
- Demonstrated verbal and written communication skills 
- Comfortable presenting issues and solutions to multiple layers of management 
- Strong analytical problem solving, data analysis, statistics, design of experiments, and process control skills 
- Strong knowledge and previous utilization of Excel* and statistical control methods 
- Ability to commit to a continuous three or six month (preferred) co-op/internship
As the world&apos;s largest chip manufacturer, Intel strives to make every facet of semiconductor manufacturing state-of-the-art -- from semiconductor process development and manufacturing, through yield improvement to final test and optimization, and lastly packaging. Employees in the Technology and Manufacturing group are part of a worldwide network of manufacturing and assembly/test facilities.
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                        <title><![CDATA[Export Compliance Analyst at Intel, (USA-CA-Santa Clara)]]></title>
                        <link>http://www.jobvolume.com/jobid.jsp?jkey=1919246755</link>
                        <guid isPermaLink="false">1919246755</guid>
                        <pubDate>Tue, 2 Dec 2008 15:03:44 GMT</pubDate>
                        <description><![CDATA[Job Description: Responsibilities may be quite diverse of a nonexempt administrative nature. Experience and education requirements will vary significantly depending on the unique needs of the job.
You should be a student currently pursuing a relevant course of studies. Additional qualifications include: 
- Demonstrate good analytical and organizational skills 
- Good verbal and written communication skills 
- Good problem solving skills 
- Microsoft* Office* skills 
- US citizenship or US permanent residency are required due to US government Export Administration Regulation requirements 
- Knowledge of computer systems and database management would be an added advantage 
- Previous experience in a multitasking environment with attention to detail and accuracy would be an added advantage
As a member of the Finance team, employees act as a full partner in making and supporting business decisions that are aimed at maximizing shareholder value. Intel Finance has a strong focus on facilitating change and improvement both within finance and in the operations supported.
Working as part of the Global Export Compliance team, the intern will review technology exports within internal databases, collect, analyze and organize export compliance data for deemed export licenses and reviews. Employee will also be responsible for various projects including, tracking, auditing and enhancing the current databases for licensing and technical review submissions. Other expectations include submitting export license extension requests to the US government.
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                        <title><![CDATA[Component Design Engineer at Intel, (USA-AZ-Phoenix)]]></title>
                        <link>http://www.jobvolume.com/jobid.jsp?jkey=2357796644</link>
                        <guid isPermaLink="false">2357796644</guid>
                        <pubDate>Tue, 2 Dec 2008 15:03:28 GMT</pubDate>
                        <description><![CDATA[In this position, you will be a member of the Globals/DA/Back end team for Jasper Forest, A NEHALEM Derivative product. You will be responsible for project DA support and may own explicit project related task. DA /tool experts support duties include providing support to the RLS team( fub owners) for DT tools. In the project specific role, you will be a member of the full chip integration team in one of following areas: FCT, FC repeaters, Extract , FCT, RV and others.
You must possess a Bachelor or a Master of Science degree in Electrical Engineering with knowledge and hands-on working experience on DT tools and/or flows including:- 
- Ability to work independently to solve problems 
- Good interpersonal communication and teamwork skills 
- Experience with Tango/tg_ta, tango-lr, carmel, Noise sim, Air stream , rls fub flows would be an added advantage
The Digital Enterprise Group (DEG) delivers innovative computing and communications platforms for companies large and small around the world. Platforms include product ingredients such as industry-leading processors, technologies, chipsets, networking components and software as well as motherboards. Working with a large community including hardware and software developers as well as government entities, DEG delivers innovative technology platforms and helps drive industry standards efforts that enable businesses to reduce costs and support growth opportunities. Whether the enterprise is publicly traded, privately owned, government or education, when Intelï¿½ platforms and products are built in, success is built in.
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                        <title><![CDATA[Wireless Standard Engineer at Intel, (USA-OR-Hillsboro)]]></title>
                        <link>http://www.jobvolume.com/jobid.jsp?jkey=1044544624</link>
                        <guid isPermaLink="false">1044544624</guid>
                        <pubDate>Tue, 2 Dec 2008 15:03:15 GMT</pubDate>
                        <description><![CDATA[In this position, you will be working as part of the wireless standards and technology team (WSaT) within Intel&apos;s Mobility Wireless Group (MWG) to lead architect, design and analysis of the next generation Mobile WiMAX standard and system. Your responsibilities will include but not be limited to: 
- Leading the design of FEC/CTC/LDPC/HARQ-IR 
- Leading architect and design of advanced wireless air interface for next generation Mobile WiMAX 
- Developing system solutions from standard including system architecture, requirements, interface and system-level integration 
- Developing, coordinating and presenting technical contributions and specifications in standards groups 
- Responsible for external interface for Intel wireless standard and technology collaboration
You should possess a Ph.D. Additional qualifications include: 
- Strong knowledge of error correction coding, Information theory and Detection/Estimation theory 
- Solid understanding of wireless communication principles in PHY layer 
- Creative problem solver with strong experience in wireless systems such as WiMAX, WiFi, 3GPP and 3GPP2. WSaT is a team responsible for wireless standards in Intel 
- Excellent understanding of wireless systems, preferably those using OFDM and MIMO 
- Strong knowledge and experience with MAC/PHY simulation using C/C++ , Matlab*, and other tools 
- Excellent analytical skills 
- Self motivated and proactive 
- Excellent communications skills and documentation and/or writing skills 
- Participation in wireless communication standard developments in standard committees for example, WiMAX Forum, IEEE 802, 3GPP, and/or 3GPP2 
- Strong knowledge and experience in wireless networks such as WiMAX, WiFi, 3GPP and 3GPP2 
- Experienced with wireless LAN and/or cellular media access control design 
- Experienced with MAC/PHY design and optimization of broadband wireless systems
Employees in Intel&apos;s Mobility Group design and implement the Intel mobile technology used in notebook computers, phones, ultra-mobile PCs and other portable devices. Intel&apos;s industry leading technology includes processors, chipsets, Enhanced Data for GSM Environment (EDGE), Universal Mobile Telecommunications System (UMTS), High-Speed Downlink Packet Access (HSDPA), Wi-Fi and WiMAX wireless radios. These industry-leading technologies are driving the new mobile era of semiconductors, where people will carry their computing with them, making it truly personal. This group is growing very quickly, and has the broadest set of mobile and wireless technologies in the industry.
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                        <title><![CDATA[CPU Power Architecture Intern at Intel, (USA-CA-Folsom)]]></title>
                        <link>http://www.jobvolume.com/jobid.jsp?jkey=3396121484</link>
                        <guid isPermaLink="false">3396121484</guid>
                        <pubDate>Tue, 2 Dec 2008 15:03:00 GMT</pubDate>
                        <description><![CDATA[Intel Folsom Architecture team is looking to hire a resourceful and highly motivated coop to work on next-generation CPU power management. The work includes and is not limited to workload analysis, power and/or performance modeling and event-based thermal monitoring validation. This is your opportunity to gain industry experience by working closely with architects. In this position, your responsibilities will include but not be limited to: 
- Responsible for Micro-Architect the next generation CPU power management policies 
- Understanding workload power and/or utilization characteristics 
- Validating that actual design meets power and/or thermal goals of the high-level simulator 
Other job responsibilities: Responsibilities may be quite diverse of a nonexempt technical nature. Experience and education requirements will vary significantly depending on the unique needs of the job. Job assignments are usually for the summer or for short periods during breaks from school. Responsibilities may be quite diverse.
You must be a student currently pursuing a Bachelor or a Master of Science degree majoring in Electrical Engineering and/or Computer Engineering and can work 40 hours per week for summer + Fall terms or Fall + Winter terms. Additional qualifications include: 
- Working knowledge in CPU power and/or thermal management schemes (ACPI, CPU P-State and C-State policies) 
- Familiarity with 3D graphics hardware or algorithms 
- Good written and verbal communication skills 
- Hands-on experience with power modeling or simulation tools would be an added advantage 
- Familiarity with CPU and chipset architecture including bus architecture, memory technology, and I/O subsystems would be an added advantage
Employees in Intel&apos;s Mobility Group design and implement the Intel mobile technology used in notebook computers, phones, ultra-mobile PCs and other portable devices. Intel&apos;s industry leading technology includes processors, chipsets, Enhanced Data for GSM Environment (EDGE), Universal Mobile Telecommunications System (UMTS), High-Speed Downlink Packet Access (HSDPA), Wi-Fi and WiMAX wireless radios. These industry-leading technologies are driving the new mobile era of semiconductors, where people will carry their computing with them, making it truly personal. This group is growing very quickly, and has the broadest set of mobile and wireless technologies in the industry.
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                        <title><![CDATA[Operations Engineer at Intel, (USA-CA-Folsom)]]></title>
                        <link>http://www.jobvolume.com/jobid.jsp?jkey=2986036617</link>
                        <guid isPermaLink="false">2986036617</guid>
                        <pubDate>Tue, 2 Dec 2008 15:02:45 GMT</pubDate>
                        <description><![CDATA[In this position, your responsibilities will include but not be limited to: 
- Managing global computing, storage, and EDA CAD resources 
- Using utilization data to drive cleanup and/or recycling of NFS storage and reallocation of compute servers, and manage the EDA CAD tool licenses for the supported business groups 
- Working with key contacts to maintain efficient allocation and high utilization of resources 
- Documentating, publishing, and delivering training on operations management processes 
- Maintaining, developing, qualifying, and regularly refreshing custom operations indicators 
- Driving global operations strategies pertinent to business groups 
- Driving qualification of remote CAD tool performance as part of DCV virtualization and/or consolidation strategy 
- Integrate new SEG teams and customer groups into established Operations processes 
- Assisting in financial planning and budgeting for global hardware/software resources 
- Driving purchase analysis, justifications, and SB execution 
- Supporting the global license and engineering environment 
- Identifying and developing innovative solutions to achieve higher DA operational efficiencies 
- HSD Administration, provide HSD oversight and top level template management, interface between customer and VT team to properly prioritize and execute customer requests, develop innovative solutions in HSD to streamline interaction and improve efficiencies
You should possess a Bachelor&apos;s degree in Electrical Engineering and a Master of Science degree and/or an M.B.A. in Business and/or Operations. Additional qualifications include: 
- Knowledge of statistical analysis techniques, decision modeling using spreadsheets, and accounting/finance principles 
- Competency in data analysis using Excel spreadsheets and graphing techniques 
- Competency in math and at least one programming language 
- Excellent verbal and written communication skills 
- Excellent organizational skills 
- Self-starter who can drive issues to a closure with little supervision
Employees in Intel&apos;s Mobility Group design and implement the Intel mobile technology used in notebook computers, phones, ultra-mobile PCs and other portable devices. Intel&apos;s industry leading technology includes processors, chipsets, Enhanced Data for GSM Environment (EDGE), Universal Mobile Telecommunications System (UMTS), High-Speed Downlink Packet Access (HSDPA), Wi-Fi and WiMAX wireless radios. These industry-leading technologies are driving the new mobile era of semiconductors, where people will carry their computing with them, making it truly personal. This group is growing very quickly, and has the broadest set of mobile and wireless technologies in the industry.
The SEG DA Engineering Business Operations team supports the operational needs of global SEG, CCG, and GDG design teams in the areas of financing, legal, computing, design environment, CAD tools, forecasting, procurement and allocation of resources.
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                        <title><![CDATA[Tapeout Process Engineer at Intel, (USA-OR-Hillsboro)]]></title>
                        <link>http://www.jobvolume.com/jobid.jsp?jkey=2348361922</link>
                        <guid isPermaLink="false">2348361922</guid>
                        <pubDate>Tue, 2 Dec 2008 15:02:25 GMT</pubDate>
                        <description><![CDATA[This is a Computer Aided Design (CAD) engineering position with primary responsibilities to own tapeout process modules that transform chip design data to mask data on all of Portland Technology Development&apos;s advanced 300 mm logic processes. In this position, you will be responsible for the success of an integrated tapeout process module that consists of compute hardware and/or software, internal and/or external software applications, layer specific application code, and automation settings. This work involves ensuring successful data transformation from module input to output within predicted throughput and compute consumption. Your responsibilities will include but not be limited to: 
- Responsible for data transformation across the tapeout module within predicted throughput and compute consumption with zero execution or quality related issues 
- Responsible for continuous improvement of throughput, reliability, and availability of the tapeout module 
- Responsible for analysis and maintenance of tapeout module control data, consumption models, metrics, and indicators 
- Directing ownership of tapeout module changes, issues, and excursions 
- Engineering disposition of quality checks and data
You should possess an Advanced degree in Computer Science or Electrical Engineering. Additional qualifications include: 
- Ability to program Linux* shell* scripts 
- Familiarity with distributed computing and datacenter system architecture 
- Proficiency with statistical data analysis, design of experiments, failure mode engineering analysis 
- Familiarity with statistical process control and configuration control concepts 
- Demonstrated ability to solve problem root causes and implement solutions 
- Demonstrated ability to solve problems and confront issues in a team situation 
- Demonstrated ability to communicate clearly in written and verbal formats 
- Experience with physical design automation compute applications that run in a Linux* environment 
- Previous experience in the areas of mask tapeout, tapeout data manipulation, or design rule and/or tapeout related flow programming would be an added advantage
As the world&apos;s largest chip manufacturer, Intel strives to make every facet of semiconductor manufacturing state-of-the-art -- from semiconductor process development and manufacturing, through yield improvement to final test and optimization, and lastly packaging. Employees in the Technology and Manufacturing group are part of a worldwide network of manufacturing and assembly and/or test facilities.
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 	</channel>
</rss>


